NEW YORK, NY, June 24, 2026 (GLOBE NEWSWIRE) -- Fabric.AI, Inc. (Nasdaq: FABC) (“Fabric.AI” or the “Company”), a fabless semiconductor company developing MicroLED-based optical interconnects for AI infrastructure, today announced that at its recent stockholder meeting, stockholders approved a proposal in connection with the Company’s partnership with Kopin Corporation (Nasdaq: KOPN) to jointly develop the Neural I/o™ MicroLED optical interconnect. The Company and Kopin are proceeding with development of the interconnect with updates on strong progress expected within the coming quarter, and an expected demonstrable platform by year’s end. "This stockholder approval validates our strategic vision and solidifies a unique opportunity to partner with an industry leader, leveraging Kopin's resources to advance an innovation with the potential to reset the standard for the AI data centers of the future," said Josh Silverman, CEO of Fabric.AI. "As AI workloads drive an unprecedented need for faster, more efficient, more scalable data movement, our Neural I/o™ MicroLED optical interconnect is designed to deliver a fundamentally different approach to connectivity — one engineered to improve power efficiency, thermal performance, density, latency, and scalability relative to traditional copper and laser-based architectures, and we look forward to demonstrating that as we advance its development." Strategic Priorities In connection with the approval, the Company reaffirmed several strategic priorities for stockholders: A focused mission. Fabric.AI is committed to becoming a leading provider of MicroLED-based optical interconnects to the AI ecosystem, differentiated from incumbent laser-based and copper/SerDes approaches by its targeted advantages in energy efficiency and interconnect density. A platform technology, not just a single product. As part of the program, Fabric.AI is developing not only the interconnect but also the underlying MicroLED transceiver and receiver — components the Company believes could potentially be used in other co-packaged optics (CPO) applications across the AI ecosystem. Building an intellectual-property position. The Company is in the process of seeking patent protection for its inventions related to the Neural I/o transceiver, receiver, and interconnect technology. Serving a large addressable market. The Company is targeting the AI-infrastructure interconnect opportunity, which third-party analysts estimate could exceed $73 billion in total addressable market by 2030. This figure represents a third-party estimate of total market size and is not a projection of Fabric.AI’s revenue. Strengthening leadership. Fabric.AI has engaged executive search firm Egon Zehnder to support the recruitment of senior leadership, including a Chief Revenue Officer and other top management positions. Program leadership. The Company’s interconnect program is led by Bill Maffucci, Head of Project Development, who is overseeing [development] of the Neural I/o platform. Upcoming investor engagement. Members of Fabric.AI management are scheduled to present at the Canaccord Genuity conference. Details will be available on the Company’s investor relations website. Technology overview The Neural I/o platform uses arrays of MicroLED emitters and photodetectors — rather than lasers — to move data optically between GPUs, accelerators, memory, and servers at short reach. The Company believes this approach can deliver meaningful advantages in energy per bit and interconnect density relative to laser-based optics and copper/SerDes electrical links, particularly for the dense, short-reach connections inside AI systems. As previously disclosed, Fabric.AI is targeting a demonstration of the Neural I/o platform by the end of 2026. How the Neural I/o MicroLED interconnect compares to laser-based and copper/SerDes approaches on aggregate bandwidth and energy per bit. Figures are aggregate / device-level design targets for illustration; see disclaimer. About Fabric.AI Fabric.AI, Inc. (Nasdaq: FABC) is a fabless semiconductor company developing MicroLED-based optical interconnects designed to address the data-movement bottleneck in AI data centers. Its Neural I/o™ program is being developed in partnership with Kopin Corporation. For more information, visit https://fabricai.com/ . About Kopin Corporation Kopin Corporation (Nasdaq: KOPN) is a leading developer and provider of innovative display and application-specific optical solutions sold as critical components and subassemblies for defense, enterprise, professional and consumer products. Kopin’s portfolio includes microdisplays, display modules, eyepiece assemblies, image projection modules and vehicle mounted and head-mounted display systems that incorporate ultra-small high-resolution Active Matrix Liquid Crystal displays (AMLCD), Ferroelectric Liquid Crystal on Silicon (FLCoS) displays, MicroLED displays (µLED) and Organic Light Emitting Diode (OLED) displays, a variety of o